US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Jan. 27 for "Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,584, issued on Jan. 27, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board" was invented by Takahiro Yamada (Fukushima, Japan), Hiroyuki Fujisawa (Fukushima, Japan) and Yuji Yamada (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containi...