US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 8 for "Fiber sheet, and layered body, circuit board and electronic board using same" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,996, issued on April 8, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Fiber sheet, and layered body, circuit board and electronic board using same" was invented by Tomohiro Fukao (Osaka, Japan), Tomoaki Sawada (Osaka, Japan), Takatoshi Abe (Osaka, Japan) and Kyosuke Michigami (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less."

The patent was filed on March 26, 2020,...