US Patent Issued to Panasonic Intellectual Property Management on April 29 for "Method for manufacturing mounting substrate, and component mounting device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,836, issued on April 29, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan).

"Method for manufacturing mounting substrate, and component mounting device" was invented by Syoichi Nishi (Fukuoka, Japan), Hideki Sumi (Fukuoka, Japan), Hiroshi Murata (Saga, Japan), Koji Sakurai (Fukuoka, Japan) and Kenichi Ichikawa (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. ...