US Patent Issued to Panasonic Holdings on July 15 for "Cutting device, and manufacturing device for laminated electrode assembly" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,173, issued on July 15, was assigned to Panasonic Holdings Corp. (Osaka, Japan).

"Cutting device, and manufacturing device for laminated electrode assembly" was invented by Hiroyuki Matsushima (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cutting device includes a drum section that rotates to convey a continuous body, and a cutting section that cuts the continuous body into multiple individual works. The drum section includes multiple holding heads that move while holding the respective works. The cutting section includes a cutter unit that moves together with multiple holding heads and that is smaller in number than the holding hea...