US Patent Issued to Pac Tech-Packaging Technologies on July 1 for "Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole" (German Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,287, issued on July 1, was assigned to Pac Tech-Packaging Technologies GmbH (Nauen, Germany).

"Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole" was invented by Matthias Fettke (Berlin), Andrej Kolbasow (Paulinenaue, Germany) and Nico Lange (Erfurt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such tha...