US Patent Issued to OVH on Nov. 25 for "Hermetic sealed electronic assembly for non dielectric immersion cooling system" (French Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,190, issued on Nov. 25, was assigned to OVH (Roubaix, France).

"Hermetic sealed electronic assembly for non dielectric immersion cooling system" was invented by Ali Chehade (Moncheaux, France) and Mohamad Hnayno (Roubaix, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components...