ALEXANDRIA, Va., July 23 -- United States Patent no. 12,364,577, issued on July 22, was assigned to OSSTEMIMPLANT Co. LTD. (Seoul, South Korea).
"Indirect bonding device and indirect bonding method for orthodontic apparatus" was invented by Jeong-Hwan Lee (Busan, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of the present invention provides an indirect bonding device for an orthodontic apparatus, the indirect bonding device comprising: a jig main body part in a form that covers the tooth surface of a subject undergoing a procedure; an accommodation part having grooves capable of accommodating an orthodontic bracket into the internal space of the jig main body part; and a discharge...