ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,734, issued on June 3, was assigned to OSRAM Opto Semiconductors GmbH (Regensburg, Germany).

"Method for producing an electronic component, and electronic component" was invented by Gunnar Petersen (Regensburg, Germany) and Daniel Richter (Bad Abbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment a method includes providing a moldable substrate, applying at least one semiconductor chip to a first main surface of the moldable substrate, introducing the semiconductor chip into the moldable substrate by deforming the moldable substrate such that the semiconductor chip is embedded into the moldable substrate proceeding from the ...