ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,917, issued on Oct. 14, was assigned to OSAKA SODA Co. LTD. (Osaka, Japan).
"Electroconductive adhesive" was invented by Ryo Katou (Osaka, Japan), Masatoshi Okuda (Osaka, Japan), Junichirou Minami (Osaka, Japan) and Takamichi Mori (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if used as an electroconductive adhesive. An electroconductive adhesiv...