US Patent Issued to Ormet Circuits on Aug. 12 for "Lithographically defined electrical interconnects from conductive pastes" (California, New Jersey Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,004, issued on Aug. 12, was assigned to Ormet Circuits Inc. (San Diego).

"Lithographically defined electrical interconnects from conductive pastes" was invented by Catherine A. Shearer (San Marcos, Calif.), Ping-Hung Lu (Bridgewater, N.J.) and Chunwei Chen (Whitehouse Station, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to electrical interconnect structures formed from a lithographically defined polymer coating in conjunction with a conductive paste, and methods for forming same."

The patent was filed on Sept. 9, 2020, under Application No. 17/640,390.

*For further information, including images, charts and tab...