ALEXANDRIA, Va., Oct. 8 -- United States Patent no. D1,096,399, issued on Oct. 7, was assigned to ORION Corp. (Seoul, South Korea).
"Packaging" was invented by Hyun A Lee (Seongnam-si, South Korea) and A Reum Lee (Anyang-si, South Korea).
The patent was filed on Aug. 25, 2023, under Application No. D/910,906.
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