ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,193, issued on Oct. 14, was assigned to OMRON Corp. (Kyoto, Japan).
"Heat-dissipating structure" was invented by Junya Mishima (Kyoto, Japan) and Tomoyuki Hakata (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer mem...