US Patent Issued to OMRON on July 1 for "Solid state relay" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. D1,081,598, issued on July 1, was assigned to OMRON Corp. (Kyoto, Japan).

"Solid state relay" was invented by Haruki Ayado (Kyoto, Japan), Tadahiko Ogawa (Kyoto, Japan), Sho Ogawa (Kyoto, Japan) and Shinya Tsuji (Kyoto, Japan).

The patent was filed on July 7, 2023, under Application No. D/879,496.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1081598&OS=D1081598&RS=D1081598

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