ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,325, issued on Nov. 11, was assigned to OmniVision Technologies Inc. (Santa Clara, Calif.).
"Fingerprint sensor with wafer-bonded microlens array" was invented by Tsung-Wei Wan (Hsinchu County, Taiwan), Wei-Ping Chen (New Taipei, Taiwan) and Jau-Jan Deng (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and ...