US Patent Issued to OmniVision Technologies on April 29 for "Multi-element wide-field lens for wafer-assembled chip-cube cameras" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,464, issued on April 29, was assigned to OmniVision Technologies Inc. (Santa Clara, Calif.).

"Multi-element wide-field lens for wafer-assembled chip-cube cameras" was invented by Kuang-Ju Wang (Taipei, Taiwan), Jau-Jan Deng (Taipei, Taiwan) and I-Lung Lu (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-level camera includes an image sensor; a concave L1 lens element on an inside surface of a first substrate; a convex L2 lens element on a first surface of a second substrate; a diaphragm stop on a second surface of the second substrate or on a first surface of a third substrate, the diaphragm stop between the second and third s...