US Patent Issued to Omniply Technologies on March 18 for "Techniques for fabricating and separating flexible microelectronics devices from rigid substrates" (Canadian Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,921, issued on March 18, was assigned to Omniply Technologies Inc. (Montreal).

"Techniques for fabricating and separating flexible microelectronics devices from rigid substrates" was invented by Francis Zaato (Montreal), Humaira Taz (Montreal), Avinash Nanayakkara (Montreal) and Harit Doshi (Montreal).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate structure and a method used in the manufacturing of flexible electronics or microelectronic devices are provided. The laminate structure comprises a rigid substrate, a flexible microelectronics structure comprising and a debonding structure provided between the rigid substrate and the flexible m...