US Patent Issued to OLYMPUS on May 13 for "Substrate laminating apparatus and substrate laminating method" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,569, issued on May 13, was assigned to OLYMPUS Corp. (Tokyo).

"Substrate laminating apparatus and substrate laminating method" was invented by Masashi Honda (Sagamihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate laminating apparatus includes: a first holding mechanism configured to hold a first substrate; a second holding mechanism configured to hold a second substrate and change a distance between the first substrate and the second substrate; a load detecting mechanism configured to detect a load originated from a surface tension acting between the first substrate and the second substrate; and a driving mechanism configured t...