US Patent Issued to OLYMPUS on Dec. 16 for "Electronic module, manufacturing method for electronic module, and endoscope" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,543, issued on Dec. 16, was assigned to OLYMPUS Corp. (Tokyo).

"Electronic module, manufacturing method for electronic module, and endoscope" was invented by Shigeru Hosokai (Hachioji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic module includes a first structure including a flat mounting surface on which an integrated circuit is mounted and a wiring surface including a surface including a portion that changes in a direction perpendicular to the mounting surface, a wire connected to the integrated circuit being extended on the wiring surface, a second structure disposed with a dielectric region interposed with respect to the wi...