US Patent Issued to OLYMPUS MEDICAL SYSTEMS on Dec. 9 for "Wiring board, image pickup unit, endoscope, and method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,495, issued on Dec. 9, was assigned to OLYMPUS MEDICAL SYSTEMS CORP. (Tokyo).

"Wiring board, image pickup unit, endoscope, and method for manufacturing wiring board" was invented by Toshiyuki Shimizu (Tokyo) and Kenjiro Kanno (Komagane, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board has a first principal surface including one or more first pads configured to bond an electronic component, one or more second pads configured not to bond another member, one or more wiring patterns connecting the one or more first pads to the one or more second pads, respectively, and a solder nonwetting region is formed on each of the one or more sec...