US Patent Issued to Oki Electric Industry on June 10 for "Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,928, issued on June 10, was assigned to Oki Electric Industry Co. Ltd. (Tokyo).

"Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof" was invented by Yuuki Shinohara (Tokyo), Takahito Suzuki (Tokyo), Kenichi Tanigawa (Tokyo), Hironori Furuta (Tokyo), Toru Kosaka (Tokyo), Yusuke Nakai (Tokyo), Shinya Jyumonji (Tokyo), Genichirou Matsuo (Tokyo), Takuma Ishikawa (Tokyo), Chihiro Takahashi (Tokyo) and Hiroto Kawada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor element unit includes a semiconductor eleme...