US Patent Issued to OKAMOTO MACHINE TOOL WORKS on July 15 for "Substrate grinding device and substrate grinding method" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,095, issued on July 15, was assigned to OKAMOTO MACHINE TOOL WORKS LTD. (Gunma, Japan).

"Substrate grinding device and substrate grinding method" was invented by Satoru Ide (Gunma, Japan), Takahiko Mitsui (Gunma, Japan), Tsubasa Bando (Gunma, Japan) and Kazuhiro Takaoka (Gunma, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate grinding device including: a work table rotatable with the work table sucking and holding a substrate; a cup wheel-type first grinding wheel configured to grind the rotating substrate while rotating, the substrate being held by the work table; and a cup wheel-type second grinding wheel configured to ...