US Patent Issued to Oji Holdings on Oct. 21 for "Pattern forming method, resist material, and pattern forming apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,737, issued on Oct. 21, was assigned to Oji Holdings Corp. (Tokyo).

"Pattern forming method, resist material, and pattern forming apparatus" was invented by Kazuyo Morita (Tokyo) and Kimiko Hattori (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "It is an object of the present invention to provide a method of forming a high-contrast fine pattern onto a resist film. The present invention relates to a pattern forming method, comprising; applying a resist material onto a substrate to form a resist film, introducing a metal into the resist film, exposing, and developing. In addition, the present invention also relates to a resist material and a pat...