US Patent Issued to Ohio State Innovation Foundation on Dec. 9 for "Utilization of interconnections in electronic circuits as magnetohydrodynamic pumps for liquid metal based cooling" (Ohio Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,522, issued on Dec. 9, was assigned to Ohio State Innovation Foundation (Columbus, Ohio).

"Utilization of interconnections in electronic circuits as magnetohydrodynamic pumps for liquid metal based cooling" was invented by Jin Wang (Columbus, Ohio) and Junchong Fan (Columbus, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "An Interconnection integrated MHD pump is used in a liquid metal cooling system to provide a pump to the liquid metal by induced magnetic field and may be connected to main electrical systems of the cooling system for providing the magnetic field. The liquid metal cooling system includes an MHD pump, cooling pad, a radiator, an...