ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,794, issued on March 4, was assigned to OCTAVO SYSTEMS LLC (Sugar Land, Texas).
"System in a package modifications" was invented by Michael Kenneth Conti (Dallas), Christopher Lloyd Reinert (Frisco, Texas) and Masood Murtuza (Sugar Land, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components."
The patent was filed on Nov. 24, 2023, under Application No. 18/518,852.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph...