US Patent Issued to NXP USA on Sept. 16 for "Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes" (American, Malaysian Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,305, issued on Sept. 16, was assigned to NXP USA Inc. (Austin, Texas).

"Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes" was invented by Sheila F. Chopin (Austin, Texas), Nishant Lakhera (Austin, Texas) and Boon Yew Low (Subang Jaya, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound."

The patent was filed on Sept. 11, 2023, under Application No. 18/464,409.

*For further informat...