US Patent Issued to NXP USA on Oct. 14 for "Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules" (Malaysian, American Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,158, issued on Oct. 14, was assigned to NXP USA INC. (Austin, Texas).

"Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules" was invented by Boon Yew Low (Subang Jaya, Malaysia), Fui Yee Lim (Sunway SPK, Malaysia), Fernando A. Santos (Chandler, Ariz.) and Dominic (PohMeng) Koey (Shah Alam, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit module includes a module substrate with a mounting surface, and a plurality of conductive features and electronic circuitry coupled to the mounting surface. Encapsulant material covers the electronic circuitry and the mounting surface, and an...