US Patent Issued to NXP USA on Nov. 25 for "Low-stress thermal interface" (Dutch, American, Malaysian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,719, issued on Nov. 25, was assigned to NXP USA INC. (Austin, Texas).

"Low-stress thermal interface" was invented by Sharan Kishore (Tempe, Ariz.), Lu Li (Gilbert, Ariz.), Jaynal A Molla (Gilbert, Ariz.), Fui Yee Lim (Sunway SPK, Malaysia), Freek Egbert van Straten (Mook, Netherlands) and Lakshminarayan Viswanathan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is bonded to a conductive metallic flange via a free-standing heterostructure thermal interface material that includes physically distinct volumes of different conductive materials. The heterostructure thermal interface material (a bimetallic foil, for example) is...