ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,719, issued on June 3, was assigned to NXP USA Inc. (Austin, Texas).
"Semiconductor device structure and method therefor" was invented by Michael B. Vincent (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method includes providing a semiconductor die at least partially encapsulated with an encapsulant. A first non-conductive layer is deposited over an active side of the semiconductor die and a surface of the encapsulant. A first opening is formed in the first non-conductive layer exposing a portion of a bond pad of the semiconductor die. A conductive interconnect trace ...