ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,089, issued on June 24, was assigned to NXP USA INC. (Austin, Texas).
"Device package substrate structure and method therefor" was invented by Chee Seng Foong (Austin, Texas), Trent Uehling (New Braunfels, Texas) and Tingdong Zhou (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device substrate is provided. The substrate includes an embedded trace substrate (ETS) portion. The ETS portion includes a first conductive layer embedded in the ETS portion at a first major surface. A portion of the first conductive layer is patterned to form a signal line. A non-conductive layer is disposed between the first conductive layer an...