US Patent Issued to NXP USA on June 17 for "Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structure" (Arizona Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,416, issued on June 17, was assigned to NXP USA Inc. (Austin, Texas).

"Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structure" was invented by Darrell Glenn Hill (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit comprises a substrate that includes a first surface and a second surface. A first through substrate via (TSV) is formed between the first surface and the second surface and a first conductive material is arranged within the first TSV to form a conductive path between the first surface and the second surface through the substrate. A second ...