US Patent Issued to NXP USA on July 1 for "Power amplifier module with transistor dies for multiple amplifier stages on a same heat dissipation structure" (Arizona Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,740, issued on July 1, was assigned to NXP USA INC. (Austin, Texas).

"Power amplifier module with transistor dies for multiple amplifier stages on a same heat dissipation structure" was invented by Stephen Reza Hiemstra (Gilbert, Ariz.), Lu Wang (Chandler, Ariz.) and Joshua Bennett English (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power amplifier module includes a module substrate. First and second heat dissipation structures extend through the module substrate, and each has a first surface exposed at a mounting surface of the module substrate, and a second surface exposed at a bottom surface of the module substrate. The first ...