ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,844, issued on Jan. 27, was assigned to NXP USA INC. (Austin, Texas).
"Double-sided multichip packages" was invented by Scott M. Hayes (Chandler, Ariz.), Wen Hung Huang (Kaosiung, Taiwan), Michael B. Vincent (Chandler, Ariz.), Antonius Hendrikus Jozef Kamphuis (Nijmegen, Netherlands), Zhiwei Gong (Chandler, Ariz.) and Leo van Gemert (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package and method of fabricating such a package includes a first and second components encapsulated in a volume of molding material. A surface of the first component is bonded to a surface of the second component. Upper and lower ...