US Patent Issued to NXP USA on Jan. 13 for "Semiconductor device with resin bleed control structure and method therefor" (American, Chinese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,511, issued on Jan. 13, was assigned to NXP USA INC. (Austin, Texas).

"Semiconductor device with resin bleed control structure and method therefor" was invented by Trent Uehling (New Braunfels, Texas), Wei Gao (Tianjin, China) and Chu-Chung Lee (Round Rock, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe including a die pad, a first ridge formed at a first outer edge of the die pad, a second ridge formed at a second outer edge of the die pad opposite of the first outer edge and separate from the first ridge, and a plurality of leads sur...