US Patent Issued to NXP USA on Aug. 5 for "Semiconductor device with enclosed cavity and method therefor" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,164, issued on Aug. 5, was assigned to NXP USA INC. (Austin, Texas).

"Semiconductor device with enclosed cavity and method therefor" was invented by Michael B. Vincent (Chandler, Ariz.) and Scott M. Hayes (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device is provided. The method includes placing a semiconductor die and an RF sub-assembly on a carrier substrate. The RF sub-assembly includes a sacrificial blank, a conductive radiant element, and a conductive shield. At least a portion of the semiconductor die and the RF sub-assembly is encapsulated with an encapsulant. The carrier substrate is sep...