US Patent Issued to NXP on Sept. 9 for "Printed circuit board with electromagnetic bandgap structure for launcher in package devices" (German Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,228, issued on Sept. 9, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Printed circuit board with electromagnetic bandgap structure for launcher in package devices" was invented by Manuel Alfredo Monedero Miranda (Munich) and Holger Kuhnert (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A Launcher in Package (LiP) device for wireless communications, e.g., radar communications at 77 GHz, includes a printed circuit board (PCB) arranged between a radio frequency (RF) chip package and a radiating antenna structure. The PCB include an electromagnetic bandgap (EBG) structure including a plurality of EBG elements printed in a periodic pattern...