US Patent Issued to NXP on Oct. 28 for "Semiconductor device with thermal dissipation and method therefor" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,664, issued on Oct. 28, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Semiconductor device with thermal dissipation and method therefor" was invented by Frank.zy Guo (Kaohsiung, Taiwan), Yi-Tien Liao (Kaohsiung, Taiwan) and Sam Lai (Kaosiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method includes attaching a first die pad of a semiconductor die to a central pad of a package leadframe. The first die pad is located in a central region on an active side of the semiconductor die. A second die pad of the semiconductor die is connected a lead of the package lead frame. ...