US Patent Issued to NXP on Dec. 9 for "UBM-free metal skeleton frame with support studs and method for fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,448, issued on Dec. 9, was assigned to NXP B.V. (Eindhoven, Netherlands).

"UBM-free metal skeleton frame with support studs and method for fabrication thereof" was invented by Che Ming Fang (Kaohsiung, Taiwan), Kuan-Hsiang Mao (Kaohsiung, Taiwan), Yufu Liu (Taoyuan, Taiwan) and Wen Hung Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC package includes one or more microelectronic devices, a plurality of package bumps disposed at a first side, and a metal structure electrically connecting at least a first device contact pad of a first microelectronic device and at least a first package bump of the plurality of package bumps...