US Patent Issued to NXP on April 29 for "Semiconductor packages with embedded wiring on re-distributed bumps" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,770, issued on April 29, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Semiconductor packages with embedded wiring on re-distributed bumps" was invented by Kuan-Hsiang Mao (San Jose, Calif.), Norazham Mohd Sukemi (San Jose, Calif.), Chin Teck Siong (San Jose, Calif.), Tsung Nan Lo (San Jose, Calif.) and Wen Hung Huang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages with embedded wiring on re-distributed bumps are described. In an illustrative, non-limiting embodiment, a semiconductor package may include an integrated circuit (IC) having a plurality of pads and a re-distribution layer (RDL) coupled to the ...