US Patent Issued to NVIDIA on Nov. 4 for "Test data transfer in multi-die systems" (California Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,880, issued on Nov. 4, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Test data transfer in multi-die systems" was invented by Nithin Anil Valentine (Santa Clara, Calif.), Shantanu Sarangi (Santa Clara, Calif.), Mahmut Yilmaz (Santa Clara, Calif.) and Ish Chadha (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes two or more discrete semiconductor dies coupled to a package substrate. The dies include a primary die and at least one secondary die. The primary die includes an external data transfer interface, a direct memory access ("DMA") controller, a primary cross-die bridge, and at least o...