ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,448, issued on June 24, was assigned to NVIDIA Corp. (Santa Clara, Calif.).
"Three dimensional circuit mounting structures" was invented by Joey Cai (Shenzhen, China), Tiger Yan (Shen Zhen, China), Zhu Hao (Shenzhen, China) and Yi Dinghai (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself."
The patent was filed on...