US Patent Issued to NVIDIA on Feb. 3 for "Cooling package structure applied to integrated circuit" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,570, issued on Feb. 3, was assigned to NVIDIA Corp. (Santa Clara, Calif.).

"Cooling package structure applied to integrated circuit" was invented by Xiao Yangyang (Santa Clara, Calif.), Jiang Zhi (Santa Clara, Calif.), Li Yuan (Santa Clara, Calif.) and Zhou Jie (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling package for an integrated circuit, including: package substrate of the integrated circuit having a first package surface, an enclosure and a thermal conductive material filling a gap between the substrate and a circuit die locatable therein and filling a gap between interior sidewalls of the enclosure and sidewall su...