ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,712, issued on Oct. 28, was assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN (Kyoto, Japan).
"Semiconductor device" was invented by Takashi Ohashi (Osaka, Japan), Takeshi Imamura (Kyoto, Japan) and Hiroto Katsuda (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer connected to and in contact with an entire surface on a back face side of the semiconductor layer; and a support bonded to a back face side of the metal layer via an adhesive. In a plan view, the support is larger in area than the sem...