US Patent Issued to NUVOTON TECHNOLOGY CORPORATION JAPAN on Feb. 18 for "Semiconductor device and chip singulation method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,337, issued on Feb. 18, was assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN (Kyoto, Japan).

"Semiconductor device and chip singulation method" was invented by Yoshihiro Matsushima (Shiga, Japan), Yoshihiko Kawakami (Osaka, Japan), Shinya Oda (Osaka, Japan) and Takeshi Harada (Kagoshima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device that is a chip-size-package-type semiconductor device that is facedown mountable includes: a semiconductor layer including a semiconductor substrate and a low-concentration impurity layer in contact with an upper surface of the semiconductor substrate; a metal layer having a thickness of at ...