ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,397, issued on Nov. 18, was assigned to NTT INC. (Tokyo).
"Semiconductor wafer" was invented by Shoko Tatsumi (Musashino, Japan), Masahiro Nada (Musashino, Japan), Yasuhiko Nakanishi (Musashino, Japan) and Shigeru Kanazawa (Musashino, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "This semiconductor wafer has formed therein a plurality of chips, each of which has incorporated therein a semiconductor element to be tested. The semiconductor wafer is characterized by comprising: first pads which are formed on the chips, and to which a plurality of probe needles are connected, the probe needles being connected to the semiconductor elements and use...