US Patent Issued to NTT on Feb. 3 for "Substrate for carrying wafer" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,531, issued on Feb. 3, was assigned to NTT Inc. (Tokyo).

"Substrate for carrying wafer" was invented by Shoko Tatsumi (Musashino, Japan), Masahiro Nada (Musashino, Japan) and Yasuhiko Nakanishi (Musashino, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on th...