ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,069, issued on Dec. 2, was assigned to NTT Inc. (Tokyo).
"High frequency package" was invented by Hiromasa Tanobe (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from t...