US Patent Issued to NORTHROP GRUMMAN SYSTEMS on July 8 for "Bump structures for low temperature chip bonding" (Maryland Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,988, issued on July 8, was assigned to NORTHROP GRUMMAN SYSTEMS Corp. (Falls Church, Va.).

"Bump structures for low temperature chip bonding" was invented by Justin C. Hackley (Catonsville, Md.) and Jeffrey David Hartman (Severn, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a multi-chip system is disclosed. The method includes forming one or more bumps on respective conductive contact pads of a first electronic device, forming one or more mini-bumps on respective conductive contact pads of a second electronic device, and aligning respective one or more mini-bumps with respective one or more bumps. The method further includes...