US Patent Issued to Northeastern University on Sept. 16 for "High rate printing of microscale and nanoscale patterns using interfacial convective assembly" (Massachusetts, California, New Jersey Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,721, issued on Sept. 16, was assigned to Northeastern University (Boston).

"High rate printing of microscale and nanoscale patterns using interfacial convective assembly" was invented by Zhimin Chai (Revere, Mass.), Adnan Korkmaz (Edison, N.J.), Cihan Yilmaz (Campbell, Calif.) and Ahmed A. Busnaina (Needham, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interfacial convective assembly can assemble any type of nanoparticles or other nanoelements in minutes to form microscale and nanoscale patterns in vias or trenches in patterned substrates. A solvent film is deposited on a patterned substrate. An aqueous suspension of nanoparticles is deposi...