US Patent Issued to Nokia Solutions and Networks on Nov. 11 for "Heat dissipation component and associated electrical device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,254, issued on Nov. 11, was assigned to Nokia Solutions and Networks Oy (Espoo, Finland).

"Heat dissipation component and associated electrical device" was invented by Hua Cai (Jiangsu, China) and Yan Xia (Jiangsu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The heat dissipation component includes a heat conductor attached to the pluggable module or a heat sink associated with an interface of an electrical device and configured to conduct heat from the pluggable module to a heat sink, the heat conductor including the heat input section configured to be in thermal contact with the pluggable module; and a heat output section configured to be ...