US Patent Issued to NITTO SHINKO on Dec. 30 for "Adhesive sheet, semiconductor module, and method for producing adhesive sheet" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,616, issued on Dec. 30, was assigned to NITTO SHINKO Corp. (Fukui, Japan).

"Adhesive sheet, semiconductor module, and method for producing adhesive sheet" was invented by Takeshi Yamaguchi (Sakai, Japan) and Maki Nakao (Sakai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive sheet according to the present invention is an adhesive sheet including a different material sheet configured to be flush with the rest of the adhesive sheet."

The patent was filed on July 2, 2021, under Application No. 18/022,835.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&S...